About us

Linseis Thermal Analysis has emerged as a global leader since it's inception in 1957. We are based in locations such as Selb (Germany), Shanghai & Beijing (China) and Robbinsville (USA) and many more.

Manufacturer of Thermal Analysis and Thermophysical Properties Equipment: DSC Calorimeter, TGA Weight change, Thermal Conductivity and more. Our techniques are DSC - Differential Scanning Calorimeter, DIL Dilatometer, STA Simultaneous Thermal Analysis, TGA Thermogravimetry, TFA Thin Film Analysis, TMA Thermomechanical analysis, Thermal Diffusivity, Thermal Conductivity, LSR, Hall-Effect and Evolved Gas Analysis.

Products and services

Linseis has a lot of experience in thermal properties measurement covers a very broad range of different thermal conductivity measurement, thermal diffusivity measurement and specific heat measurement systems.

Differential Scanning Calorimeter (DSC) are the perfect instruments for characterization of polymers: melting, crystallization, glass transition, OIT (oxidation/ induction time), thermal stability, the composition of rubber mixtures and curing behaviour of thermosetting materials.

Thermogravimetric analysis (TGA) is performed on polymers, food, pharmaceuticals as well as many other materials.

TGA PT 1000

The Linseis TGA PT 1000 for thermogravimetric applications is a toploading Thermobalance, which offers a highly user-friendly design. Even at a sample weight of up to 5g the tara is done electronically.

The specially designed furnaces allow fast heating and cooling rates from 0.001 bis 250°C/min as well as a highly precise temperature control from (10°C) RT up to 1100°C.
The instrument is highly suitable for thermal composition, thermal stability and oxidation studies.

Further reading

Chip-DSC 10

The new Chip-DSC 10 is the worlds only commercial Heat Flux DSC with integrated heater and temperature sensor and provides the new Chip-Sensor-Technology for easy replacement of the sensor.

The Quench cooling accessories provide an open cooling container surrounding the sensor and sample. Coolant dependent, i.e. dry ice or LN2, sample temperature can go down to -180 °C. This system does not allow defined gas atmospheres while measuring, as outgasing will surround the sample.

Further reading

Thermal Conductivity – THB and LaserFlash

The Linseis Transient Hot Bridge - THB – Thermal Conductivity Meter enables thermal conductivity, thermal diffusivity and specific heat measurements on various sample geometries and materials. Also, the flash method has developed into the most commonly used technique for the measurement of thermal diffusivity and thermal conductivity of various kinds of solids, powders and liquids.

Further reading

Linseis Messgeräte GmbH
Vielitzerstr. 43
95100 Selb

Phone: +49 9287 880-52
Fax: +49 9287 70488
Internet: www.linseis.com
E-mail: Send message

Contact person

Florian Linseis
Managing Director
Phone: +49 9287 8800
E-mail: Send message

Linseis Shanghai Scientific
Kaige Scientific Park 2653 Hunan Road
201315 Shanghai
P. R. China

Phone: +86 21 61901202
Internet: www.linseis.com.cn
E-mail: Send message
Linseis Shanghai Scientific
Rm. 2-229, Core Plaza, 1 Shanyuan Street, Haidian District
100080 Beijing
P. R. China

Phone: +86 10 62237812
Internet: www.linseis.com.cn
E-mail: Send message

News & Innovations

Bavarian government funding supports the new chip-technology for thermal analysis
The excellent cooperation between Linseis Messgeräte GmbH and the University of Bayreuth (well known for its Polymer Research) pays off. The Bavarian Research Foundation presented a grant of € 250,000 for the next product development: Chip-DSC with thermobalance.

In recent years, the two project partners have already developed a mini version of the so-called Differential Scanning Calorimeter (DSC), which is used primarily in materials research. The new laboratory device has been equipped with an innovative chip technology that makes it more versatile and delivers faster measurement results. Plastic analyzes are possible in one-third of the time, as with a conventional DSC device.

The next product development is working on not only learning when a material decomposes on heating, but also how much mass the material loses.

Further reading

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