Linseis Thermal Analysis

Booth number 10A23

www.linseis.com

We develop and produce measuring instruments for the determination of thermal conductivity, weight change and thermoelectric analysis.

About us

The Linseis Thermal Analysis business unit has emerged as a global leader since it's inception in 1957. Our main offices and application laboratiories are located in Selb (Germany), Shanghai & Beijing (China) and Robbinsville (USA).

We develop and produce measuring instruments for the determination of thermal conductivity, weight change and thermoelectric analysis: DSC Differential Scanning Calorimetry, DIL Dilatometry, STA Simultaneous Thermal Analysis, TGA Thermogravimetry, TFA Thin Film Analysis, TMA Thermomechanical Analysis, Thermal Diffusivity, Thermal Conductivity, LSR Thermoelectric, HCS Hall-Effect.

One special field of application for our instruments is the analysis of polymers. With our DSC series, we are able to determine the key parameters like glass transition, grade of crystallinity as well as oxidation and decomposition behavior. Beside that, we can measure thermal conductivity, e-modulus, softening and creeping and, of course, thermal expansion.

Address
Linseis Thermal Analysis
Vielitzer Str. 43
95100 Selb
Germany

Phone: +49 928 78800
Internet: www.linseis.com

Representative
Linseis Shanghai Scientific
Kaige Scientific Park 2653 Hunan Road
201315 Shanghai
P. R. China

Phone: +86 21 61901202
Internet: www.linseis.com.cn
Linseis Shanghai Scientific
Room 705, block B, wanjiashengjing building, Dengzhuang South Road, Haidian District
100094 Beijing
P. R. China

Phone: +86 10 62237812
Internet: www.linseis.com.cn

Products and services

Differential Scanning Calorimeter are the perfect instruments for characterization of polymers: melting, crystallization, glass transition, OIT (oxidation/ induction time), thermal stability, the composition of rubber mixtures and curing behaviour of thermosetting materials.

Our Chip-DSC technology is based on a new sensor that combines all essential parts of DSC: furnace, sensor and electronics in a miniaturized housing.

The chip-arrangement comprises the heater and temperature sensor in a chemically inert ceramic arrangement with metallic heater and temperature sensor.

Chip-DSC 1

The Chip-DSC 1 is the low-priced entry model of the DSC-series and allows fastest possible ballistic cooling rates without any active cooler. Due to the low thermal mass and innovative sensor design, cooling rates up to 200°C/min from maximum temperature to 100°C and up to 50°C/min from 100°C to room temperature are possible.

Further reading

Chip-DSC 10

The new Chip-DSC 10 is the worlds only commercial Heat Flux DSC with integrated heater and temperature sensor and provides the new Chip-Sensor-Technology for easy replacement of the sensor.

The Quench cooling accessories provide an open cooling container surrounding the sensor and sample. Coolant dependent, i.e. dry ice or LN2, sample temperature can go down to -180 °C. This system does not allow defined gas atmospheres while measuring, as outgasing will surround the sample.

Further reading

Chip-DSC 100

The new chip technology, combining the heater and temperature sensor in a chemically inert ceramic arrangement with metallic heater and temperature sensor, is also available in our established DSC series.

Applications on the Chip-DSC 100 are expandable by various options: High Pressure, Optical DSC with CCD camera, Photo DSC with UV light, coupling of a RAMAN Spectrometer, Sample robot for 96 samples.

Further reading

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